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Hubbell HYC26C2 Grounding and Bonding, C-Tap, DB, #10AWG, 2, Index 0, 5-Pack

Brand: Hubbell Premise Wiring
ADI #:40-HYC2L12 Model #: HYC2L12  Name: Hubbell HYC26C2 Grounding and Bonding, C-Tap, DB, #10AWG, 2, Index 0, 5-Pack
  • Die index provides verification that the correct die was used to make the crimp
  • Grounding and bonding compression device
  • Compression taps provide an irreversible and low resistant bond of conductors
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